CVE-2019-2288

high

Description

Out of bound write in TZ while copying the secure dump structure on HLOS provided buffer as a part of memory dump in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, IPQ8074, MDM9150, MDM9206, MDM9607, MDM9650, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8976, MSM8996, MSM8996AU, MSM8998, QCA8081, QCS605, QM215, SDA660, SDA845, SDM429, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, Snapdragon_High_Med_2016, SXR1130

References

https://www.qualcomm.com/company/product-security/bulletins/november-2019-bulletin

Details

Source: Mitre, NVD

Published: 2019-12-12

Updated: 2026-06-17

Risk Information

CVSS v2

Base Score: 7.2

Vector: CVSS2#AV:L/AC:L/Au:N/C:C/I:C/A:C

Severity: High

CVSS v3

Base Score: 7.8

Vector: CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Severity: High

EPSS

EPSS: 0.00033