CVE-2019-14093

high

Description

Array out of bound access can occur in display module due to lack of bound check on input parcel received in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9650, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, QCM2150, QCS405, QCS605, QM215, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM632, SDM636, SDM660, SDX20

References

https://www.qualcomm.com/company/product-security/bulletins/july-2020-security-bulletin

https://www.qualcomm.com/company/product-security/bulletins/july-2020-bulletin

Details

Source: Mitre, NVD

Published: 2020-07-30

Updated: 2026-06-17

Risk Information

CVSS v2

Base Score: 4.6

Vector: CVSS2#AV:L/AC:L/Au:N/C:P/I:P/A:P

Severity: Medium

CVSS v3

Base Score: 7.8

Vector: CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Severity: High

EPSS

EPSS: 0.0011