CVE-2018-11277

high

Description

In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.

References

https://www.qualcomm.com/company/product-security/bulletins

Details

Source: Mitre, NVD

Published: 2018-09-20

Updated: 2026-06-17

Risk Information

CVSS v2

Base Score: 4.6

Vector: CVSS2#AV:L/AC:L/Au:N/C:P/I:P/A:P

Severity: Medium

CVSS v3

Base Score: 7.8

Vector: CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Severity: High

EPSS

EPSS: 0.00037