CVE-2017-18314

critical

Description

In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ.

References

https://www.qualcomm.com/company/product-security/bulletins

https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components

Details

Source: Mitre, NVD

Published: 2018-09-20

Updated: 2026-06-17

Risk Information

CVSS v2

Base Score: 10

Vector: CVSS2#AV:N/AC:L/Au:N/C:C/I:C/A:C

Severity: Critical

CVSS v3

Base Score: 9.8

Vector: CVSS:3.0/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H

Severity: Critical

EPSS

EPSS: 0.00287