CVE-2017-18157

high

Description

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.

References

https://www.qualcomm.com/company/product-security/bulletins

Details

Source: Mitre, NVD

Published: 2019-05-06

Updated: 2026-06-17

Risk Information

CVSS v2

Base Score: 7.2

Vector: CVSS2#AV:L/AC:L/Au:N/C:C/I:C/A:C

Severity: High

CVSS v3

Base Score: 7.8

Vector: CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H