CVE-2016-2063

HIGH

Description

Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.

References

http://www.securityfocus.com/bid/92381

https://us.codeaurora.org/cgit/quic/la/kernel/msm-3.10/commit/?id=ab3f46119ca10de87a11fe966b0723c48f27acd4

https://www.codeaurora.org/stack-overflow-msm-thermal-driver-allows-kernel-memory-corruption-cve-2016-2063

Details

Source: MITRE

Published: 2016-08-07

Updated: 2016-11-28

Type: CWE-119

Risk Information

CVSS v2.0

Base Score: 10

Vector: AV:N/AC:L/Au:N/C:C/I:C/A:C

Impact Score: 10

Exploitability Score: 10

Severity: HIGH

CVSS v3.0

Base Score: 9.8

Vector: CVSS:3.0/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H

Impact Score: 5.9

Exploitability Score: 3.9

Severity: CRITICAL