CVE-2016-2063

high

Description

Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.

References

https://us.codeaurora.org/cgit/quic/la/kernel/msm-3.10/commit/?id=ab3f46119ca10de87a11fe966b0723c48f27acd4

http://www.securityfocus.com/bid/92381

Details

Source: Mitre, NVD

Published: 2016-08-07

Updated: 2020-08-06

Risk Information

CVSS v2

Base Score: 4.6

Vector: CVSS2#AV:L/AC:L/Au:N/C:P/I:P/A:P

Severity: Medium

CVSS v3

Base Score: 7.8

Vector: CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Severity: High