CVE-2016-2063

HIGH
New! CVE Severity Now Using CVSS v3

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Description

Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.

References

http://www.securityfocus.com/bid/92381

https://us.codeaurora.org/cgit/quic/la/kernel/msm-3.10/commit/?id=ab3f46119ca10de87a11fe966b0723c48f27acd4

https://www.codeaurora.org/stack-overflow-msm-thermal-driver-allows-kernel-memory-corruption-cve-2016-2063

Details

Source: MITRE

Published: 2016-08-07

Updated: 2020-08-06

Type: CWE-119

Risk Information

CVSS v2

Base Score: 4.6

Vector: AV:L/AC:L/Au:N/C:P/I:P/A:P

Impact Score: 6.4

Exploitability Score: 3.9

Severity: MEDIUM

CVSS v3

Base Score: 7.8

Vector: CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Impact Score: 5.9

Exploitability Score: 1.8

Severity: HIGH

Vulnerable Software

Configuration 1

OR

cpe:2.3:o:linux:linux_kernel:*:*:*:*:*:*:*:* versions from 3.0 to 3.19.8 (inclusive)

Tenable Plugins

View all (1 total)

IDNameProductFamilySeverity
124978EulerOS Virtualization for ARM 64 3.0.1.0 : kernel (EulerOS-SA-2019-1525)NessusHuawei Local Security Checks
high